Wylie BGA Underfill CPU Epoxy Glue for Apple iPhone

Name: Wylie BGA Underfill CPU Epoxy Glue for Apple iPhone
Brand: Wylie
SKU: 336269
Price: 13.95 EUR
Availability: OutOfStock

ID: 336269

EAN: 107082004893

€13,95

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Product type

BGA Underfill CPU Epoxy Adhesive

Pack	Blaar
Content	BGA Underfill CPU Epoxy Adhesive
Product status	New

Wylie BGA Underfill CPU Epoxy Adhesive

for Apple iPhone

Wylie BGA Underfill CPU Epoxy Adhesive is the ideal solution for professional repairs of Apple iPhone components.

Specially designed to provide a robust and durable support, this adhesive is used to reinforce the bonds between BGA chipsets and PCB (motherboard),

reducing the risk of damage caused by mechanical shock or temperature variations. An essential product for GSM repair technicians,

ensuring performance and reliability in high-precision interventions.

Features:

High compatibility: Specially designed for Apple iPhone devices

Superior Protection: Prevents cracks and detachments in BGA and PCB components

Excellent durability: Epoxy formula provides strong adhesion and long-term durability

Precise application: Easy to use due to optimized design for detailed repairs